Distec wins "Major Design Win 2022" prize from Congatec

At the end of May 2023, the congatec Sales Partner Meeting took place in Prague. Various awards were presented to successful sales partners. With the "Major Design Win 2022" we were rewarded by congatec for our outstanding design work on new projects.

We are very happy about this, because the award shows good cooperation within Distec GmbH as well as with our partner, congatec AG.

Together we find the optimal solution for our customers, such as an embedded motherboard, a computer-on-module or a kit consisting of a single board computer, cable, operating system, display and touch.

For other projects we use standard systems like our BoxPC Pro NPA-2009 with unique V-by-One and eDP TFT display interface (also available as SBC NPA-2009 with V-by-One and eDP interface) or our PanelPC or Monitor solutions.

And if none of this fits, our hardware and software or mechanical developers are ready to offer our customers a full custom solution.

We would like to thank congatec for the award.

The picture shows from left to right Carlos Bastinos, Manager Sales Partner Global, congatec; Michael Golod, Partner Manager EMEA, congatec and Thomas Schrefel our Product Manager Embedded at the award ceremony.