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Distec GmbH

Tel.: +49 89 894363 - 0

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Webinar: COM-HPC - Next Generation High Performance Computing

COM-HPC is the new Computer-on-Module standard for High Performance Computing. It is not intended to replace the COM Express standard, but to supplement it with high-performance processor modules with up to 300W.

For an insight into the new COM standard, we offer you the free participation in the webinar of our manufacturer congatec:

 

Monday, 15 March 2021 from 09:00 to 12:00.

The following topics will be discussed:

  • Why a new standard? The PICMG workgroup
  • The COM-HPC connector
  • Module types and sizes
  • COM Express vs. COM-HPC
  • Cooling concepts
  • Signal integrity challenges
  • congatec COM-HPC roadmap and schedules
  • New COM-HPC interface technology
  • congatec evaluation boards
  • Q&A

To register, please send a short e-mail with your contact details to: Mr. Thomas Schrefel (thomas.schrefel@distec.de). The last day to register is 01 March 2021.

We look forward to your participation.

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